Technical Tour of the 3D MID Congress' will be leading this year to the HOCH.REIN Group

Monday, 10/01/2018

The 13th Molded Interconnect Devices (MID) Congress brings together industry and research on all topics related to mechatronically integrated assemblies in Würzburg. The biennial congress is the world’s leading event on MID technology.

It provides an ideal framework to learn about the current state of the art, to exchange information with technology experts and MID users, and to establish contacts with scientists from all MID-relevant disciplines.

The congress is always connected with a final technical tour. This year, the HOCH.REIN Group welcomed the international guests to the INNOPARK in Kitzingen. Subsidiaries of HOCH.REIN presented their innovative technologies and mechatronic applications. For example, Hermann Issa represented OPVIUS GmbH, Yusuf Akdeniz chargeIT mobility GmbH, Karl Bühler WÜST Technology GmbH, Thomas Küssner MKB GmbH and Andreas Meisetschläger RST GmbH. The Technical Tour was rounded off with guided tours of the chargeIT workshop and OPVIUS production.